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Evaluation of thermal degradation of polymer based electronic materials by non-destructive testing

Autor(en)
P. Rafiee, G. Khatibi, M. Lederer, M. Zehetbauer
Abstrakt

Thermal degradation of polymeric materials used in microelectronic packages was studied by means of experimental modal analysis in combination with finite element methods. The devices were subjected to vibrational loads subsequent to various stages of high temperature storage and their modal response was recorded. Statistical methods and finite element analysis were applied to quantify and evaluate the alteration of the modal response of the packages due to the degradation / delamination of the silver filled epoxy adhesive and the glass filled epoxy resin molding compound. It was shown that changes in the material properties of the molding compound due to surface oxidation is the dominant cause for alteration of the modal response of encapsulated packages exposed to high temperatures.

Organisation(en)
Physik Nanostrukturierter Materialien
Externe Organisation(en)
Technische Universität Wien
Journal
Journal of Physics: Conference Series
Band
790
Anzahl der Seiten
5
ISSN
1742-6588
DOI
https://doi.org/10.1088/1742-6596/790/1/012026
Publikationsdatum
02-2017
Peer-reviewed
Ja
ÖFOS 2012
103018 Materialphysik
ASJC Scopus Sachgebiete
Allgemeine Physik und Astronomie
Link zum Portal
https://ucrisportal.univie.ac.at/de/publications/5c374e47-2afe-464b-b02b-11ec460b04b7