Evaluation of thermal degradation of polymer based electronic materials by non-destructive testing

Autor(en)

P. Rafiee, G. Khatibi, M. Lederer, M. Zehetbauer

Abstrakt

Thermal degradation of polymeric materials used in microelectronic packages was studied by means of experimental modal analysis in combination with finite element methods. The devices were subjected to vibrational loads subsequent to various stages of high temperature storage and their modal response was recorded. Statistical methods and finite element analysis were applied to quantify and evaluate the alteration of the modal response of the packages due to the degradation / delamination of the silver filled epoxy adhesive and the glass filled epoxy resin molding compound. It was shown that changes in the material properties of the molding compound due to surface oxidation is the dominant cause for alteration of the modal response of encapsulated packages exposed to high temperatures.

Organisation(en)

Physik Nanostrukturierter Materialien

Externe Organisation(en)

Technische Universität Wien

Journal

Journal of Physics: Conference Series

Band

790

Anzahl der Seiten

5

ISSN

1742-6588

DOI

https://doi.org/10.1088/1742-6596/790/1/012026

Publikationsdatum

02-2017

Peer-reviewed

Ja

ÖFOS 2012

103018 Materialphysik

ASJC Scopus Sachgebiete

Allgemeine Physik und Astronomie

Link zum Portal

https://ucrisportal.univie.ac.at/de/publications/5c374e47-2afe-464b-b02b-11ec460b04b7